Laser vision measurement - GAM - 70

Features:

All operations are easy and using Window’s interface in Chinese / English version.
Survey the thickness of tin solder by automatically and manually.
Survey the length and width manually, and the gap of tin solder.
Calculate the measure of area, the measure of cross section and the measure of volume automatically.
All surveyed values can be recorded to a file and be printed to a report.
Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.
Calculate manufacture ability degree automatically (CP, CPK, CPM)
It can have separate record according to every different production line.
It can adjust focal distance in different thickness of PC boards.
It can be called to sample periodically.

Application

Get the results of statics and analysis about all surveyed values in every thickness degree.
Inspect the quality of solder printing process.
Survey the thickness of tin solder.
Measure the dimension of tin solder.
Provide thickness and dimension measurement function for the objects.

Function

Surveying the thickness of printing tin solder, length, height and gap.
Provide the references of thickness distribution values.
Provide the analysis of different measure of cross-section.
Calculate the measure of area and volume automatically in object which to be surveyed.
Provide all diagrams of statics and analysis.
Provide X Control diagram, R Control Diagram and thickness list diagram.
Provide X average Control diagram, Single point list diagram.
Calculating and printing of X and R control diagram.
Calculation and statics of Manufacture Ability Degree in CP, CPK, CPM and so on.

Option

Menus and survey options

Dimensions of Thickness distribution

Specifications