Crimp cross-sectional analysis has quickly become an integral part of the crimp quality process. With the MicroGraph System (MGS), crimp cross-sectional images can be created in a fraction of the time compared to conventional methods.
The combined sawing-polishing process, innovative electrolyte staining process, and high precision optics result in high quality images for thorough analysis of the connection. Electrical connections (e.g. crimped, welded, soldered or spliced) can be cut (sawed), polished, stained (cleaned), and visually analyzed.
The system includes modular components that can be combined according to individual needs. Ergonomically designed work tables are also available to optimize workflow when combining the components in one area. The complete system can also be integrated into mobile carts to create a mobile quality station.