| Kit Name | Main Components |
| QFP Tool | QFP Lead Straightening Tool |
| B-24 Board | SIR Test Board |
| B-25 Board | SIR Test Board |
| B-36 Board | SIR Test Board LCC68 |
| FC176 Flip Chip Substrate | 176 Bump Flip Chip 204µm |
| FC88 Flip Chip Substrate | 88 Bump Flip Chip 204µm |
| FC317 Flip Chip Substrate | 317 Bump Flip Chip 254µm |
| FC220 Flip Chip Substrate | 220 Bump Flip Chip 204µm |
| CBGA196 Ceramic Substrate | 4x CBGA196 1.27mm pitch |
| CBGA1089 Ceramic Substrate | 2x CBGA1089 1.27mm pitch |
| FC96 Flip Chip Ceramic Substrate | FC96 Flip Chip 457µm |
| FC96 Flip Chip Substrate | FC96 Flip Chip 457µm |
| FC48 Flip Chip Ceramic Substrate | FC48 Flip Chip 457µm |
| FC48 Flip Chip Substrate | FC48 Flip Chip 457µm |
| Beginner's Throughhole | 24 Traditonal Throughhole Components |
| FC112 Flip Chip Substrate | FC112 Flip Chip 152µm |
| Re-certification by Hand | Low Cost Mixed Technology for Re-certification |
| Multilayer Lead Free Throughhole | DIP14 Daisy Chain + Connector + Zero Ohm Resistors + Capillary PTH Test |
| Mixed Technology 2 | Fine Pitch SMD and BGA, Chips and Throughhole |
| Multipurpose Throughhole Machine Run | 900 Plated Throughholes |
| Multipurpose Throughhole Hand Assembly | 900 Plated Throughholes |
| BGA352-BGA400 Kit | BGA352 1.27mm & BGA400 1.5mm (OBSOLETE) |
| Machine Run | Large board 9"x8" chips, BGA, TQFP, TSOP, PLCC |
| Challenger 1 | See new Challenger 2 #928001 |
| µBGA TV46 | Tessera µBGA CSP46 0.75mm pitch |
| µBGA TV74 | Tessera µBGA CSP74 (Obsolete) |
| µBGA TV188 | Tessera µBGA CSP188 (Obsolete) |
| Beginners SMT | Simple Kit with PLCC, SOIC, SOT, Chips |
| SMD Introductory Kit | QFP, PLCC, SOIC, SOT, Chips |
| Practical Hand Kit | QFP, PLCC, SOIC, SOT, DIP, chips |
| Challenger 2 Kit | QFP, BGA, PLCC, SOIC, SOT, Chips |
| Jumbo Chip Kit | 0402, 0603, 0805, 1206 chips |
| Advanced SMD 1 | QFP, TQFP, TSOP |
| Advanced SMD 2 | QFP,TQFP, TSOP |
| µBGA TV62 | Tessera µBGA CSP62 RAMBUS 0.8mm/1.0mm (Obsolete) |
| µBGA TV208 | Tessera µBGA CSP208 RAMBUS 0.5mm (Obsolete) |
| Stencil Eval 0.3mm Pitch | TQFP, QFP, BGA, TSOP, PLCC |
| Stencil Eval 0.4mm Pitch | QFP, BGA, TSOP, PLCC |
| BGA256/272 Kit | BGA256/272 Pitch 1.27mm |
| Econo Kit 2 | TQFP, SO, DIP, Chips |
| Econo Kit 3 | QFP, PLCC, SO, DIP, Chips + throughhole |
| Monster Kit | See 948001 |
| 0.3mm Pitch Kit | TQFP168 (obsolete) |
| Rework Practice 2 | QFP, PLCC, SOIC, SOT, chips |
| PCMCIA | LQFP, TSOP, Chips |
| Universal BGA 1.27/1.5mm | BGA for 1.27mm and 1.5mm pitch without daisy-chain |
| Multiple BGA | Daisy-chain Top: BGA196/256/272/352/388 Back: BGA225/352/388 |
| Monster Kit 2 | Combines Advanced 930001 and Challenger 2 Kits 928001 |
| 0201 / 0401 Kit | 0201 chips on top side and 0402 chips on back side of board. Daisy Chain |
| SABER Array | 4-Board array Mixed Technology designed by SMTA fine-pitch, BGA, TSOP, SIR coupon, Wave solder coupons, etc |
| Multiple CBGA | CBGA121,196,256,304,361,625 on FR-4 Board |
| B-52 SIR Test | Cleanliness & Residue Evaluation Test IPC-B-52 Compatible |
| Visual Placement Inspection | Acrylic with sticky surface for BGA 1.27mm and 1.5mm pitch |
| Visual Placement Inspection | Acrylic with sticky surface for µBGA and CSP 0.5mm to 0.8mm pitch |
| Visual Placement Inspection | Acrylic with sticky surface for 0.8mm and 1.0mm BGA |
| Visual Placement Inspection | Acrylic with sticky surface for Flip Chip 204um, 254um and 457um pitch |
| Visual Placement Inspection | Acrylic with sticky surface for Flip Chip Grid Lines 4mil to 20mil |
| Visual Placement Inspection | View of Layers of Typical Visual Boards |
| HP Saber Alloy Test Kit | 4-Layer SABER PCA OSP |
| Die Bond Kit | Die Bond to QFN48 Lead Frame with daisy chain |
| CLGA | CLGA239, 334, 383, 559, 608, 944, 1007 with daisy chain |
| CBGA196 and CBGA625 | CBGA196/625 with daisy chain |
| BGA1225 and BGA1089 | BGA1225 & BGA1089 with daisy chain |
| Machine Diagnostic Kit | 3 Machine Diagnotic kits: Speed, Rotational & Fiducials |
| TSOP32 Kit | 9 each TSOP32 0.5mm pitch |
| Fiducial Evaluation | QFP100 with 10 different fiducial marks |
| BQFP132 | BQFP132 25 mils |
| QFP160 | QFP160 0.65mm Pitch |
| Rotational Placement 360° | TSOP, SO, Chips |
| Multiple QFP 0.4mm to 0.8mm | QFP120, QFP160, QFP208, QFP256 |
| QFP208 | QFP208 0.5mm Pitch |
| QFP256 | QFP256 0.4mm Pitch |
| Universal BGA 0.5mm - 0.8mm | Universal BGA with non-daisy chain pads for 0.5mm, 0.75mm and 0.8mm pitch |
| Chip Shooter 0402 / 0603 | 0402 and 0603 Chips Daisy Chain |
| Rework Practice 1 | QFP, PLCC, SOIC, SOT, chips |
| BGA169 / 225 Daisy Chain Test | BGA169 and BGA225 1.5mm pitch |
| Chip Shooter 0805 / 1206 | 0805 and 1206 Chips |
| Mixed Technology 1 | QFP, PLCC, SOIC, Chips, DIP |
| SMD Bread Board | Snaps apart for Prototyping |
| Sample Display Boards for Show & Tell | Parts mounted in plastic case |
| Not used | Internal Use |
| CCGA1089 - 1.27mm (SRO 35mil) and CCGA1247 - 1.0mm (SRO 33mil) | Column Grid Array FR4 Board |
| BGA1600 - BGA1936 | BGA1600 and BGA1936 1.0mm Pitch |
| QFN Board | 20 Different QFN 0.4mm~0.65mm , 3mm ~ 12mm , 8L ~ 80L |
| Metcal Rework Practice Board | Rework Practice Board 3 |
| Rework 3 Kit | Rework Practice 3 Kit |
| NASA Solder Training Board | Throughhole Practice Board |
| 01005 / 0201 Chip | Daisy Chain Zero Ohm Chip Board |
| Universal BGA 1.0mm / 0.8mm | Universal BGA board for 1.0mm and 0.8mm pitch |
| Lead Free QFP208 | QFP208 with Ni-Pd leads and tin board |
| Lead Free 0805 / 1206 chips | 0805 and 1206 chips with tin terminations and tin board |
| Lead Free 0402 / 0603 chips | Lead Free 0402 and 0603 chips |
| Lead Free BGA | See 947 board |
| Lead Free BGA and Fine Pitch | Lead Free BGAs, QFP, chips |
| BGA and Fine Pitch | HASL Sn/Pb version of 986001 |
| Global Fiducial Only | Global Fiducial Only 5.5" x 8" |
| Fine Pitch BGA 0.8mm / 1.0mm Pitch | BGA676 1.0mm and BGA100 0.8mm pitch |
| Fine Pitch BGA 0.8mm / 1.0mm Pitch | BGA672 1.0mm and BGA100 0.8mm pitch |
| BGA172 - 1.0mm Pitch 12mm | 12-Layer Board BGA172 |
| CGA1752 - 1.0mm Pitch | 4-Layer Board Column Grid Array |
| BGA1752 - 1.0mm Pitch | 4-Layer Board Ball Grid Array |
| BGA324 - 1.0mm Pitch 23mm | BGA Concentric Ring Cleanliness Board |
| BGA272 - 1.27mm Pitch 27mm | BGA Concentric Ring Cleanliness Board |
| BGA676 - 0.8mm Pitch 23mm | BGA Concentric Ring Cleanliness Board |
| BGA2025 - 0.4mm Pitch 21mm | BGA Concentric Ring Cleanliness Board |
| BGA Substrates | Practice Substrates for BGA Semiconductor Manufacturing Equipment |
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