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PCB Assembly and Wire Processing Equipments

Schunk

Ultrasonic splicing / compacting

Schunk

The Schunk process module enables wires to be compacted with ultrasound. As an alternative to ferrules, compacting is increasingly being used for control cabinet construction.

Ultrasonic compaction offers excellent electrical properties and can be used flexibly for wiring terminals and controls. The compaction process is precise and, thanks to comprehensive process monitoring, stable and safe: The cores to be compressed are moved against each other at low pressure and by high-frequency mechanical vibrations. In a fraction of a second, a permanent, solid and metallurgically pure connection with excellent electrical conductivity is created. Thanks to the motorized infeed, it is possible to process different lines and compression lengths in a sequence without conversion work. The process parameters are set via the intuitive HMI/TopWin user interface or the touchscreen.

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